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Specification Plating: Substrates
This section lists the common and not so
common substrates that Epner plates
to withstand most adhesion tests such as those encountered
when soldering or brazing. This list represents an accumulation
of years of experience in plating
"difficult" materials for the aerospace and other
cutting-edge industries.
Aluminum
Aluminum Alloys
Al Be Met
AlSig
Be Be Oxide
Beryllium
Beryllium Copper
Copper
Copper Alloys
Hafnium
Invar
Kovar
Magnesium
Molybdenum |
NeFe Boron
Nickel
Nickel Alloys
Phosphor Bronze
Steel
Stainless Steel
Stainless Steel Alloys
Tantalum
Titanium
Tungsten
Tungsten-Copper
Zinc
Plastics, Ceramics and
Other Dialectrics |
The
metals we deposit
To
these specifications
On
these substrates
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Epner's Laser Gold
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| Aluminum CNC Machined
Housing. .0005” Electroless Nickel, .0001” Gold. |
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